Yet another Hacker News

Infineon marks innovation milestone with 300mm power silicon carbide wafer

25 points sshah03 54 minutes ago 5 comments

bradknowles 25 minutes ago | parent

The summary at the top of that page is:

Infineon marks innovation milestone with world’s first 300-millimeter power silicon carbide (SiC) wafer

PBusiness & Financial Press Nov 09, 2026

Infineon presents industry-first functional power devices processed on 300-millimeter silicon carbide wafers

Technological breakthrough underlines Infineon’s innovation strength and leadership in power semiconductors and wide-bandgap technologies

300-millimeter SiC process feasibility lays the foundation for secure, future-proof SiC supply to customers in automotive, renewable energy, industrial and AI data center applications

Infineon will present the first processed 300-millimeter SiC wafer to the public at the electronica trade show starting 10 November 2026 in Munich

novaRom 6 minutes ago | parent

Can you guys restart DRAM production in Europe again? If 20 or so years ago it was possible, today is the best economical opportunity.

alephnerd 5 minutes ago | parent

Memory packaging is non-trivial and Europe currently doesn't have players in that space.

The primary players are South Korea, Taiwan, the US, and China and most of their capex in the space is in Asia and the US.